Approvals |
ISO/TS 16949:2009
ISO9001:2008
UL
|
Printed circuits |
1 – 2 sided, Multilayer (up to 16 layers) RF circuits Microwave circuits Thermal material circuits |
Base material |
FR1, FR2, CEM1, CEM3, FR4, G200, IS410, Arlon (PTFE), Thermal Clad, Rogers, Polyimide |
Cu thickness |
18 – 140 um |
Base thickness |
0,3 – 5,0 mm |
Maximum size |
1 – 2 sided 610 x 510mm, Multilayer 430 x 300mm |
Minimum drilled diameter |
0,25mm (0,15mm after plating) |
Minimum track and gap |
100 um |
Aspect ratio |
10 : 1 |
Surface |
Conductive polymer, HASL, Lead free HASL, Ni/Au, Ag, Sn
Peelable solder resist printing |
Soldermask |
Coates photo image (green, blue, black, red) |
Legend |
Coates (white, black, yellow) |
Contour |
Routing, CNC scoring, pressing |
Data format |
Gerber, X-Gerber, Gerber 247X + Excellon
Sieb & Meyer, ODB++ |
Testing |
Speedy Flying Probe, Econo Tower and Versa-Jet & Tower |
Service |
PCB design and assembly, microsections |
Delivery |
Standard 10 working days for single sided ,Pth and Multilayer with an Express service of 24 hours + |