FR4 PCB Surface Finishes

When a PCB is produced, a number of factors are taken into account, including the PCB layout itself, the material requirements, the laminates, inner layers, and the layer stack of the board. However, engineers frequently pay less attention to the surface finish. Most understand that the soldering of the components would be compromised if the PCB's bare copper was allowed to oxidise but don’t understand which PCB finish they should specify. Generally speaking, the primary factors to consider are the amount of storage needed, the final use, the assembly procedure, the PCB design itself, and of course, the cost. Here is a quick description of each. Contact us for advice on any additional concerns you may have about an appropriate finish for your application.

OSP (Organic Solderability Preservative)

Standard thickness : 0.20 - 0.65µm
Shelf Life : 6 months

OSP is a popular ecologically friendly finish which is reasonably priced and that helps to prevent copper oxidation and enhances solderability. Suitable for multiple heat cycles during the assembly process.