Equipment & Capabilities

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PCB Capabilities

Anything is Possible

Circuit / Panel Size

  Standard Advanced
Single Sided Max. 510 x 610mm  
Double Sided Non PTH Max. 510 x 610mm  
Silver Through Hole Max. 510 x 610mm  
PTH Max. 457 x 610mm Max. 610 x 1000mm
Multilayer Max. 457 x 610mm Max. 610 x 1000mm
Layer count Up to 20 Up to 58


  Standard Advanced
FR1 Yes Yes
FR2 Yes Yes
CEM-1 Yes Yes
CEM-3 Yes Yes
FR4 (Standard & Hi-TG) ITEQ, Kingboard, Shengyi, Nanya, Grace, Isola, Ventec, EMC Nelco, Rogers, Panasonic, Taconic, Ventec, EMC, others available on request
Aluminium Denka, Bergquist, Laird, Ventec Denka, Bergquist, Laird, Ventec
Pre-pregs 106, 1080, 2113, 2116, 2125, 7628 106, 1080, 2113, 2116, 2125, 7628, 106NF, 1080NF
Other Materials Please Enquire Please Enquire

Copper Foil

  Standard Advanced
Single Sided 1oz (35µm) - 2oz (70µm) 30oz (Thirty) (1050µm)*
PTH 1oz (35µm) - 30oz (1050µm) 30oz (1050µm)*
Multilayer (Outer layers) 1µm - 6oz (210µm) 6oz (1050µm)*
Multilayer (Inner Layers) ½oz (18µm) – 6oz (210µm) 15oz (525µm)*
Metal Clad PCB 1oz (35µm) – 6oz (210µm) 12oz (420µm)*
ASPECT RATIO 10:01 16:01

Surface Finishes

  Standard Advanced
Hot Air Solder Level Yes Yes
Lead Free Hot Air Solder Level Yes Yes
EPAG Yes Yes
Immersion Gold (ENIG) Yes Yes
Immersion Silver Yes Yes
Immersion Tin Yes Yes
Hard Gold & Gold Finger Yes Yes
OSP Yes Yes

Solder Masks, Idents and Carbon

  Standard Advanced
Photoimageable (LPI) Solder Mask Green, Blue, White, Black Red, Orange, Purple, Grey & Others on request
Via Plugging Yes Yes
Peelable Solder Mask Standard & Hi-Temp-Blue, Green, Red Standard & Hi-Temp-Blue, Green, Red
UV Curable ident (Silkscreen) White, Yellow, Black Green, Red, Blue, Brown
Carbon Key Pads Yes Yes
Carbon Links No Yes

CNC Drilling

  Standard Advanced
Min. Finished Hole Size (Mechanical) 0.20mm 0.15mm
Min. Finished Hole Size (Laser) 0.10mm 0.05mm
Minimum Punched Hole Size 0.80mm 0.70mm


  Standard Advanced
Track & Gap ±20% ±10%
Layer Registration ±0.10mm ±0.10mm


  Standard Advanced
Hole Diameter (PTH) ±0.075mm ±0.050mm
Hole Diameter (Non-PTH) ±0.10mm ±0.050mm
Hole Diameter (Punched) ±0.15mm ±0.10mm
Hole Location ±0.05mm  


  Standard Advanced
Track & Gap ±20% ±10%

Solder Mask

  Standard Advanced
Via Plugging (100% Fill) –20% -10%
Via Size ≤0.50mm ≤0.60mm
Registration 0.025mm 0.020mm
Solder Dam Width Min. 0.15mm Min. 0.10mm
Thickness Over Trace (Surface) Min. 10µm Min. 15µm
Solder Mask Pad Size Min. 15µm  


  Standard Advanced
Maximum board thickness 6.00mm 10.00mm
Minimum board thickness 0.30mm 0.20mm
Minimum Track / Gap Inner layer 0.10mm 0.05mm
Minimum Track / Gap Outer layer (35µm) 0.10mm 0.05mm
Finished PCB Thickness ±10%  
Routing Profile ±0.15mm ±0.10mm
V-Cut profile ±0.15mm ±0.10mm

Electrical Test

  Standard Advanced
% Tested (Open / Short test) 100% 100%
QFP Pitch 16mil (0.40mm) 12mil (0.30mm)
BGA Pitch 16mil (0.40mm) 12mil (0.30mm)
Connector Pitch 16mil (0.40mm) 12mil (0.30mm)

Other Options

  Standard Advanced
AOI All Multilayer All Multilayer
Impedance Control ± 10% ± 5%
Solderability Testing As standard As standard
Ionic Contamination On Request On Request
Micro Section and Micro Section Report On Request On Request
XRAY and XRF On Request On Request

Special Requirements


Lead Times: UK Manufacture

Board Type Standard Quick Turn
Single Sided 10 Days 48 Hrs
PTH 10 Days 48 Hrs
Multilayer From 10 Days From 3 Days

Lead Times: Europe & Far East Manufacture

Board Type Manufacturing Lead Time
Quick Turn ≤ 5sqft From 5 Days
Single Sided 10 – 20 Days dependant on volume
PTH 15 – 25 Days dependant on volume
Multilayer 15 – 30 Days dependant on volume & Technology
Air Freight Lead Time – 4 Days
Sea Freight Lead Time – 20 Days
All Far East lead times are subject to customs clearance
Premium International shipments can be arranged by DHL, Fedex, UPS or TNT at extra cost

Built to Perform

Our List of Capital Equipment

Inner layer / outer layer imaging

Fabtech Chemical Clean Line
KST LED exposure unit
Automatic Hakuto Cut Sheet Laminator
Automatic Schmid Cut Sheet Laminator
Manual Hand Laminator
GSPK Engineering -- Develop -Acid etch - Strip line with Low Acid Copper Controller
Camtek Orion AOI
MIVA 2025L Duo Direct Imaging Machine


Fabtech inner layer chemical prep line
DIS inner layer camera alignment and welding system
2 x 4 daylight Burkle presses with cooling press


ABCON Xray drill
7 Lenz drills with load / unload (2 with depth drilling and camera alignment)
1 Lenz DRB 610 1+1 with depth control, camera alignment & automation

Copper Plating

Schmid Deburring Machine
Fabtech Horizontal Chemical Desmear
GSPK Engineering Horizontal Direct Metallisation Line
Automated Viking (SP) Copper plating line (4 Copper Cells) with Reverse Pulse Plating
Manual Copper Via Fill line (BV110)
Fischer MMS PC2 Copper Measuring system
Fischer Picascope Copper Measuring System

Outer Etch

UCE Horizontal Strip --Etch --Strip line with Vacuum Ammonia Etching Chamber
Camtek Orion AOI

Solder resist

UCE Solder Resist Preparation Line (MecEtch) with integrated panel cleaner
DP10 and DP1500 vertical coating system
Electrostatic spray for Extreme heavy copper
Orbotech Sprint 150 Ink jet printer
Microcraft ink jet printer
ITC Resin Fill and planariser system
KST LED exposure system

Final Finishes

Viking (SP) Automatic Vertical ENIG/ENIPIG line
EPAG prototype line
PPT Automatic Vertical Immersion Tin Line
Muscat Horizontal Stirling Silver line
Horizontal OSP line
Cemco Quicksilver Lead Free HASL with Flux and cleaning lines
2 Fischerscope XRF measuring systems


6 Lenz routers --2 dedicated metal
Engel EG-V12-2X CNC Scoring Machine - IMS
Engel EG-V12-2X CNC Scoring Machine - FR4
ITP X-Y-Z measuring system
Mondo X-Y-Z Measuring Table

Electrical test

2 ATG A5 flying probe testers
A3 ATG flying probe tester
3 Speedy flying probe testers
Mania fixture tower testers
Polar instruments Impedance tester CITs 880s

Outgoing QA

2 Optilia Video Inspection Stations
Struers Automatic Microsection Preparation Equipment
Struers Structure Expert Measuring and Archiving system
Struers 200 X computerised camera inspection

Additional Testing Equipment

Accelerated Aging Equipment
Solderability Equipment
Peel / Pull Test Equipment
Solvent Resistance Testing
Clare Instruments Hi-Pot Testing


2 x Vacuum packing systems


The Factory has the ability to run 35% of the equipment, in the event of a major power cut, using an in house Diesel generator