| Home > Manufacturing > Equipment Capabilities |
Anything is Possible
| Standard | Advanced | |
| Single Sided | Max. 510 x 610mm | |
| Double Sided Non PTH | Max. 510 x 610mm | |
| Silver Through Hole | Max. 510 x 610mm | |
| PTH | Max. 457 x 610mm | Max. 610 x 1000mm |
| Multilayer | Max. 457 x 610mm | Max. 610 x 1000mm |
| Layer count | Up to 20 | Up to 58 |
| Standard | Advanced | |
| FR4 (Standard & Hi-TG) | ITEQ, Kingboard, Shengyi, Nanya, Grace, Isola, Ventec, EMC | Nelco, Rogers, Panasonic, Taconic, Ventec, EMC, others available on request |
| Aluminium | Denka, Bergquist, Laird, Ventec | Denka, Bergquist, Laird, Ventec |
| Pre-pregs | 106, 1080, 2113, 2116, 2125, 7628 | 106, 1080, 2113, 2116, 2125, 7628, 106NF, 1080NF |
| Other Materials | Please Enquire | Please Enquire |
| Standard | Advanced | |
| Single Sided | 1oz (35µm) - 2oz (70µm) | 30oz (1050µm) |
| PTH | 1oz (35µm) - 4oz (140µm) | 30oz (1050µm) |
| Multilayer (Outer layers) | ½oz (18µm) - 6oz (210µm) | 30oz (1050µm) |
| Multilayer (Inner Layers) | ½oz (18µm) – 6oz (210µm) | 30oz (1050µm) |
| Metal Clad PCB | 1oz (35µm) – 6oz (210µm)* | 15oz (525µm)* |
| ASPECT RATIO | 10:01 | 16:01 |
* Top Copper Layer
| Standard | Advanced | |
| Hot Air Solder Level | Yes | Yes |
| Lead Free Hot Air Solder Level | Yes | Yes |
| ENEPIG | Yes | Yes |
| EPAG | Yes | Yes |
| Immersion Gold (ENIG) | Yes | Yes |
| Immersion Silver | Yes | Yes |
| Immersion Tin | Yes | Yes |
| Hard Gold & Gold Finger | Yes | Yes |
| OSP | Yes | Yes |
| Standard | Advanced | |
| Photoimageable (LPI) Solder Mask | Green, Blue, White, Black | Red, Orange, Purple, Grey & Others on request |
| Via Plugging | Yes | Yes |
| Peelable Solder Mask | Standard & Hi-Temp-Blue, Green, Red | Standard & Hi-Temp-Blue, Green, Red |
| UV Curable ident (Silkscreen) | White, Yellow, Black | Green, Red, Blue, Brown |
| Carbon Key Pads | Yes | Yes |
| Carbon Links | No | Yes |
| Standard | Advanced | |
| Min. Finished Hole Size (Mechanical) | 0.20mm | 0.15mm |
| Min. Finished Hole Size (Laser) | 0.10mm | 0.05mm |
| Minimum Punched Hole Size | 0.80mm | 0.70mm |
| Standard | Advanced | |
| Track & Gap | ±20% | ±10% |
| Layer Registration | ±0.10mm | ±0.10mm |
| Standard | Advanced | |
| Hole Diameter (PTH) | ±0.075mm | ±0.050mm |
| Hole Diameter (Non-PTH) | ±0.10mm | ±0.050mm |
| Hole Diameter (Punched) | ±0.15mm | ±0.10mm |
| Hole Location | ±0.05mm |
| Standard | Advanced | |
| Track & Gap | ±20% | ±10% |
| Standard | Advanced | |
| Via Plugging (100% Fill) | –20% | -10% |
| Via Size | ≤0.50mm | ≤0.60mm |
| Registration | 0.025mm | 0.020mm |
| Solder Dam Width | Min. 0.15mm | Min. 0.10mm |
| Thickness Over Trace (Surface) | Min. 10µm | Min. 15µm |
| Solder Mask Pad Size | Min. 0.15mm |
| Standard | Advanced | |
| Maximum board thickness | 6.00mm | 10.00mm |
| Minimum board thickness | 0.30mm | 0.20mm |
| Minimum Track / Gap Inner layer | 0.10mm | 0.05mm |
| Minimum Track / Gap Outer layer (35µm) | 0.10mm | 0.05mm |
| Finished PCB Thickness | ±10% | |
| Routing Profile | ±0.15mm | ±0.10mm |
| V-Cut profile | ±0.15mm | ±0.10mm |
| Standard | Advanced | |
| % Tested (Open / Short test) | 100% | 100% |
| QFP Pitch | 16mil (0.40mm) | 12mil (0.30mm) |
| BGA Pitch | 16mil (0.40mm) | 12mil (0.30mm) |
| Connector Pitch | 16mil (0.40mm) | 12mil (0.30mm) |
| Standard | Advanced | |
| AOI | All Multilayer | All Multilayer |
| Impedance Control | ± 10% | ± 5% |
| Solderability Testing | As standard | As standard |
| Ionic Contamination | On Request | On Request |
| Micro Section and Micro Section Report | On Request | On Request |
| XRAY and XRF | On Request | On Request |
| PLATED SLOTS – EDGE PLATING – COUNTERSINKING – EDGE BEVELLING – JUMP SCORING – BARCODING – COUNTERBORING – DEPTH ROUTINGDEPTH DRILLED VIAS BLIND AND BURIED |
| OTHERS AVAILABLE ON REQUEST |
| Board Type | Standard | Quick Turn |
| Single Sided | 10 Days | 48 Hrs |
| PTH | 10 Days | 48 Hrs |
| Multilayer | From 10 Days | From 3 Days |
| Board Type | Manufacturing Lead Time |
| Quick Turn ≤ 5sqft | From 5 Days |
| Single Sided | 10 – 20 Days dependant on volume |
| PTH | 15 – 25 Days dependant on volume |
| Multilayer | 15 – 30 Days dependant on volume & Technology |
| Air Freight Lead Time – 4 Days |
| Sea Freight Lead Time – 20 Days |
| All Far East lead times are subject to customs clearance |
| Premium International shipments can be arranged by DHL, Fedex, UPS or TNT at extra cost |
Our List of Capital Equipment
| Fabtech Chemical Clean Line |
| KST LED exposure unit |
| Automatic Hakuto Cut Sheet Laminator |
| Automatic Schmid Cut Sheet Laminator |
| Manual Hand Laminator |
| GSPK Engineering -- Develop -Acid etch - Strip line with Low Acid Copper Controller |
| Camtek Orion AOI |
| MIVA 2025L Duo Direct Imaging Machine |
| Fabtech inner layer chemical prep line |
| DIS inner layer camera alignment and welding system |
| 2 x 4 daylight Burkle presses with cooling press |
| ABCON Xray drill |
| 7 Lenz drills with load / unload (2 with depth drilling and camera alignment) |
| 1 Lenz DRB 610 1+1 with depth control, camera alignment & automation |
| Schmid Deburring Machine |
| Fabtech Horizontal Chemical Desmear |
| GSPK Engineering Horizontal Direct Metallisation Line |
| Automated Viking (SP) Copper plating line (4 Copper Cells) with Reverse Pulse Plating |
| Manual Copper Via Fill line (BV110) |
| Fischer MMS PC2 Copper Measuring system |
| Fischer Picascope Copper Measuring System |
| UCE Horizontal Strip --Etch --Strip line with Vacuum Ammonia Etching Chamber |
| Camtek Orion AOI |
| UCE Solder Resist Preparation Line (MecEtch) with integrated panel cleaner |
| DP10 and DP1500 vertical coating system |
| Electrostatic spray for Extreme heavy copper |
| Orbotech Sprint 150 Ink jet printer |
| Microcraft ink jet printer |
| ITC Resin Fill and planariser system |
| KST LED exposure system |
| Viking (SP) Automatic Vertical ENIG/ENIPIG line |
| EPAG prototype line |
| PPT Automatic Vertical Immersion Tin Line |
| Muscat Horizontal Stirling Silver line |
| Horizontal OSP line |
| Cemco Quicksilver Lead Free HASL with Flux and cleaning lines |
| 2 Fischerscope XRF measuring systems |
| 6 Lenz routers --2 dedicated metal |
| Engel EG-V12-2X CNC Scoring Machine - IMS |
| Engel EG-V12-2X CNC Scoring Machine - FR4 |
| ITP X-Y-Z measuring system |
| Mondo X-Y-Z Measuring Table |
| 2 ATG A5 flying probe testers |
| A3 ATG flying probe tester |
| 3 Speedy flying probe testers |
| Mania fixture tower testers |
| Polar instruments Impedance tester CITs 880s |
| 2 Optilia Video Inspection Stations |
| Struers Automatic Microsection Preparation Equipment |
| Struers Structure Expert Measuring and Archiving system |
| Struers 200 X computerised camera inspection |
| Accelerated Aging Equipment |
| Solderability Equipment |
| Peel / Pull Test Equipment |
| Solvent Resistance Testing |
| Clare Instruments Hi-Pot Testing |
| 2 x Vacuum packing systems |
| The Factory has the ability to run 35% of the equipment, in the event of a major power cut, using an in house Diesel generator |